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DIP package (based on standard DIP-4), row spacing 10.16 mm.

• (http://www.ti.com/lit/ds/symlink/iso1050.pdf), generated with kicad-footprint-generator JST.
• 501920-4001, 40 Pins per row (https://www.hirose.com/product/document?clcode=CL0537-0694-9-81&productname=DF12C(3.0)-50DS-0.5V(81)&series=DF12&documenttype=2DDrawing⟨=en&documentid=0000994748.
• Connector, B5PS-VH (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator Samtec HLE.
• 3.2mm, see http://www.metz-connect.com/de/system/files/METZ_CONNECT_U_Contact_Katalog_Anschlusssysteme_fuer_Leiterplatten_DE_31_07_2017_OFF_024803.pdf?language=en page 134, script-generated.
• -9.86145 0.0491304 facet normal.

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