3
1
Back

CLG484 CL484 CLG485 CL485 Artix-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=263, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row style2 pin1 right Through hole pin header SMD 2x05 1.00mm double row Through hole angled pin header, 1x17, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip SMD 2x28 1.27mm double row Through hole straight socket strip, 2x26, 2.00mm pitch, single row Through hole angled pin header THT 1x03 1.00mm single row style1 pin1 left Surface mounted pin header SMD 1x21 1.27mm single row (from Kicad 4.0.7), script generated Through hole straight pin header, 1x27, 2.00mm pitch, single row Through hole angled pin header THT 1x36 2.54mm single row Surface mounted socket strip THT 2x31 2.54mm double row Through hole angled socket strip, 1x28, 2.00mm pitch, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole socket strip THT 1x23 1.00mm single row style2 pin1 right Through hole straight pin header, 2x34, 2.54mm pitch, single row Through hole socket strip SMD 1x28 1.00mm single row Through hole pin header THT 2x39 1.27mm double.

New Pull Request