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BackLTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: T5 15.200mm 0.5984" (1 hole) T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole) Total plated holes unplated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole Total plated holes unplated through holes: unplated through holes: ============================================================= From a22bca6d29ddc0a54597dab4d11ad9ab7e48e3c6 Mon Sep 17 00:00:00 2001 Subject: [PATCH 03/13] More assembly notes cb59d1e9c06865f5bebe8c7ee0afa4859e0766b2 Update Schematics/schematic_bugs_v1.md dcaec240831d28b722a7d7988287c76a1461e439 more fixes glide fix a5c5ff12ce18fecaaf346f973863d12bf361ac82 re-re-remove the mysterious extra trace Added schmancy pcb for v1 front panel components version Latest commits for file Schematics/MK_Schematic.png rev "2.0 alpha 5" 1 Tag RSS.
- 4 Ports, https://cdn.amphenol-cs.com/media/wysiwyg/files/drawing/rjhse538x04.pdf RJ45 8p8c quad ethernet.
- 10mm DIGIT 4 digit 7 segment yellow, https://docs.broadcom.com/docs/AV02-2553EN.
- Adapt them if they do not.