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4.0x4.0x0.8 mm Body [SOIC] (https://docs.broadcom.com/docs/AV02-0169EN SOIC 1.27 SSO, 7 Pin Double Sided Module Texas Instruments EUK 7 Pin Double Sided Module 16-pin module, column spacing 22.86 mm (900 mils THT DIP DIL ZIF 7.62mm 300mil 4-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads.

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