Labels Milestones
BackDF11-10DP-2DSA, 5 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py DFN, 6 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-dfn/(DCB6)%20DFN%2005-08-1715%20Rev%20A.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 6 times 1 mm² wires, basic insulation, conductor.
- Module https://www.quectel.com/download/quectel_bg96_hardware_design_v1-4 Quectel BG96 Cellular GSM 2G.
- (https://katalog.we-online.de/em/datasheet/9774040482.pdf), generated with kicad-footprint-generator connector.