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Notes main synth_tools/3D Printing/Cases/Eurorack Modular Skeleton History The body text, captions, sub-headers, etc. In AD&D 1e type faces Final revision; added custom DRC as project file tstamp 30cbcf99-eb70-4e15-8409-33e0ecd46602) Final revision; added custom DRC as project file Fireball/Fireball.kicad_dru | 102 Fireball/Fireball.kicad_pro | 32 Fireball/Fireball.kicad_sch | 120 Fireball/fp-info-cache | 51 ...D_DO-41_SOD81_P7.62mm_Horizontal.kicad_mod | 51 .../Jack_6.35mm_PJ_629HAN.kicad_mod | 29 aoKicad | 1 nF | Unpolarized capacitor | | | | | D3, D4, D5, D8, D9, D10 | 8 "use_height_for_length_calcs": true From 01bb4964a63ffeda0774c500204d2687e8f4164c Mon Sep 17 00:00:00 2001 Subject: [PATCH] Initial commit Dual VCA, based roughly on Moritz Klein's work, but will need painting. Could be glued on with CA or hot glue, if the PCB is used. In loop position, loop\nis connected to shell ground, but not to front panel Added schmancy pcb for v2 front panel 82024e96c9 updated C14 footprint, traces, groundplane 2cbdb94ba9 updated C5 footprint & tracing; schematic annotation updated C5 footprint & tracing; schematic annotation updates the potentiometer pads and thermal vias; see section 7.5 of http://www.st.com/resource/en/datasheet/DM00340475.pdf WLCSP-66, 9x9 raster, 4x4mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/DM00257211.pdf WLCSP-64, 8x8 raster, 3.347x3.585mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f469ni.pdf WLCSP-180, 13x14 raster, 5.537x6.095mm package, pitch 0.6mm; http://ww1.microchip.com/downloads/en/DeviceDoc/39969b.pdf Zynq-7000 BGA, 15x15 grid, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=80, NSMD pad definition (http://www.ti.com/lit/ds/symlink/opa330.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments EUK 7 Pin Double Sided Module 16-pin module, column spacing 22.86 mm (900 mils), LongPads 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), see https://www.power.com/sites/default/files/product-docs/lnk520.pdf SMD DIP DIL PDIP SMDIP 2.54mm 9.53mm 375mil Clearance8mm 4-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads THT DIP DIL PDIP SMDIP 2.54mm 15.24mm 600mil Socket 24-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils THT DIP DIL PDIP 2.54mm 15.24mm 600mil SMDSocket SmallPads 4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 22.86mm 900mil Socket LongPads 4-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 32-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils 8-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 6-lead though-hole mounted DIP package, row spacing.

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