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For ECP5 FPGAs, based on this and/or Hagiwo's quantizer, if going digital ** https://note.com/solder_state/n/nde97a0516f03 and https://www.youtube.com/watch?v=op_DhPr2goc ** arduino nano clone (atmega 328p), 12-bit dac (mcp4726) and small amounts of supporting hardware Microcontroller and smoothed PWM https://kassu2000.blogspot.com/2019/10/quantizer.html using a gate. Main synth_tools/Schematics/SynthMages.pretty/6.3mm_NPTH_MAXJLCPCB.kicad_mod 24 lines Binary files /dev/null and b/Panels/FireballSpell_Large.webp differ Binary files /dev/null and b/musescore_example.mscz differ * Knurled cylinder outer diameter, generated with kicad-footprint-generator ipc_gullwing_generator.py Halo N6 SO, 16 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/436412f.pdf#page=22), generated with kicad-footprint-generator ipc_qfp_generator.py 64-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1 mm Body, 2.00 mm Footprint [TQFP] (see Microchip Packaging Specification 00000049CH.pdf SC-74, 6 Pin (https://www.silabs.com/documents/public/data-sheets/Si7020-A20.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SOIC, 16 Pin (http://cds.linear.com/docs/en/datasheet/37551fd.pdf#page=23), generated with kicad-footprint-generator Soldered wire connection, for 4 times 1 mm² wires, reinforced insulation, conductor diameter 2mm, size source Multi-Contact FLEXI-E/HK 0.127 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 2.5 mm² wires, basic insulation, conductor diameter 1.25mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-E 0.1 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-128-02-xxx-DV-BE-LC, 28 Pins per row, Mounting: Snap-in Plastic Peg PCB Lock (http://www.molex.com/pdm_docs/sd/039300020_sd.pdf.

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