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Back- 14x14mm body, 9.5mm sq thermal pad TSSOP HTSSOP 0.65 thermal pad LQFP, 32 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/8008S.pdf#page=20), generated with kicad-footprint-generator ipc_gullwing_generator.py LQFP, 64 Pin (https://www.infineon.com/dgdl/Infineon-MA12040-DS-v01_00-EN.pdf?fileId=5546d46264a8de7e0164b7467a3d617c#page=81), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for a box film cap for 100v is smaller, but not necessary for voltage dividers feeding chip inputs don't do manual connection to GND.
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