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(http://www.onsemi.com/pub/Collateral/NCP4308-D.PDF DD Package; 8-Lead Plastic SO, Exposed Die Pad (see https://www.diodes.com/assets/Package-Files/SO-8EP.pdf 20-Lead Plastic Shrink Small Outline Package (MS) [MSOP], variant of 8-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 18-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 12-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 5x-dip-switch SPST Omron_A6S-510x, Slide, row spacing 7.62 mm (300 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 8x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils), Socket 64-lead though-hole mounted DIP package, row spacing 15.24 mm (600.

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