Labels Milestones
Back1 FF1761 FFG1761 Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=271, ttps://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=281, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=82, NSMD pad definition Appendix A BGA 484 1 FB484 FBG484 FBV484 Artix-7, Kintex-7 and Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=301, NSMD pad definition Appendix A BGA 256 1 FT256 FTG256 Spartan-7 BGA, 15x15 grid, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=270, NSMD pad definition Appendix A BGA 1156 1 FF1157 FFG1157 FFV1157 FF1158 FFG1158 FFV1158 Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=95, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments EUW 7 Pin Double Sided Module Texas Instruments HSOP 9, 1.27mm pitch, single row Through hole pin header THT 2x04 1.00mm double row Through hole angled socket strip SMD Solder 3-pad Jumper, 1x1.5mm Pads, 0.3mm gap, pads 1-2 Bridged2Bar with 2 copper strips SMD Solder 3-pad Jumper, 1x1.5mm rounded Pads, 0.3mm gap, pads 1-2 bridged with 2 copper strip.
- -0.714676 0.586516 0.3811 facet.
- Plus any associated claims.
- Normal 1.029044e-01 6.892302e-03 9.946674e-01 facet.