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0.5 R-XBGA-N12 Texas Instruments, DSBGA, 3.415x3.535x0.625mm, 64 ball 8x8 area grid, NSMD pad definition Appendix A BGA.

• Epson MC-406 https://support.epson.biz/td/api/doc_check.php?dl=brief_MC-306_en.pdf, hand-soldering, 9.6x4.1mm^2.
• X="4.3" y="2.1"/> Amidon-T20 L_Toroid, Horizontal series, Radial.
• Toyocom FA-238 series https://support.epson.biz/td/api/doc_check.php?dl=brief_fa-238v_en.pdf.

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