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9.78x25.04mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 8x-dip-switch SPST Copal_CHS-08A, Slide, row spacing 15.24 mm (600 mils 42-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads 22-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils SMD DIP DIL PDIP 2.54mm 25.4mm 1000mil Socket 40-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 15.24mm 600mil Socket 3M 28-pin zero insertion force socket, through-hole, row spacing 15.24 mm (600 mils), SMDSocket, LongPads 40-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 20-lead surface-mounted (SMD) DIP package, row spacing 8.9 mm (350 mils), body size (see https://www.omron.com/ecb/products/pdf/en-a6h.pdf SMD DIP DIL ZIF 25.4mm 1000mil SMDSocket SmallPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 32-lead surface-mounted (SMD) DIP package, row spacing 8.61 mm (338 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 7x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/tophx_family_datasheet.pdf PowerIntegrations variant of 8-Lead Plastic Small Outline Package (MS) [MSOP] (see Microchip Packaging Specification 00000049BS.pdf DFN, 8 Pin (http://www.winbond.com/resource-files/w25q32jv%20revg%2003272018%20plus.pdf#page=68), generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.2mm, height 9.6, Wuerth electronics 9774110960 (https://katalog.we-online.de/em/datasheet/9774110960.pdf,), generated with kicad-footprint-generator ipc_gullwing_generator.py.

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