Labels Milestones
Back3.228x4.164mm package, pitch 0.5mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32l152zc.pdf UFBGA 132 Pins, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/ts3a24159.pdf Texas Instruments, DSBGA, area grid, YBG pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l4p5ve.pdf ST WLCSP-115, ST die ID 495, 4.4x4.38mm, 100 Ball.
- ST die ID 471.
- Converter DCDC-Converter, Artesyn, ATA Series.
- 0.0623609 -0.633162 0.771503 facet.
- -3.647550e-003 5.735580e-001 facet normal.