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- 3.3x3.3x1 mm Body with Exposed Pad (see Microchip Packaging Specification 00000049BS.pdf 20-Lead Plastic Quad Flat, No Lead Package (UC) - 3x3x0.5 mm Body [SSOP] (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Shrink Small Outline (SSO/Stretched SO), see https://www.vishay.com/docs/84299/vor1142b4.pdf SSO Stretched SO SOIC Pitch 2.54 SSO Stretched SO SOIC Pitch 2.54 SSO Stretched SO SOIC 1.27 16 12 Wide 16-Lead Plastic DFN (2mm x 2mm) (see Linear Technology DFN_8_05-08-1718.pdf DFN, 8 Pin (https://www.nxp.com/docs/en/data-sheet/TJA1051.pdf#page=16), generated with kicad-footprint-generator Molex LY 20 series connector, 14110913010xxx (https://b2b.harting.com/files/download/PRD/PDF_TS/1411XX13010XXX_100228421DRW063C.pdf), generated with kicad-footprint-generator Molex Pico-EZmate side entry JST SUR series.

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