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Wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch.

• -4.10946 7.85151 facet normal.
• -0.634279 0.0992069 facet normal.
• -2.97699 -3.82407 21.7653 vertex 3.62229 3.03882 21.7538.
• 3.507279e-15 -7.910530e-01 6.117476e-01 facet normal -0.097632 0.989307.
• 0.33181 -0.0703594 vertex 2.34079 -9.54557.

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