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Temperature and humidity module Digital Proximity, Ambient Light, RGB and Gesture Sensor (https://docs.broadcom.com/doc/AV02-4191EN DFN Sensor optical IR SST LuminOX Luminescence-based O2 sensor, https://sstsensing.com/wp-content/uploads/2021/08/DS0030rev15_LuminOx.pdf Gas Sensor, 6 pin, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://www.tme.eu/Document/4baa0e952ce73e37bc68cf730b541507/T821M114A1S100CEU-B.pdf SMD vertical IDC header THT 1x19 2.00mm single row style1 pin1 left Surface mounted pin header SMD 1x27 1.00mm single row Through hole angled pin header, 2x19, 1.27mm pitch, double rows Surface mounted socket strip THT 1x32 1.27mm single row style1 pin1 left Surface mounted pin header SMD 1x04 2.00mm single row style1 pin1 left Surface mounted socket strip THT 1x06 5.08mm single row male, vertical entry Harwin LTek Connector, 3 pins, pitch 10mm, size 115x8.1mm^2, drill diamater 1.2mm, pad diameter 2.5mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00012_DB_EN.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_MetzConnect THT terminal block RND 205-00016 pitch 5mm size 15x12.6mm^2 drill 1.3mm pad 2.6mm Terminal Block WAGO 236-606, 45Degree (cable under 45degree), 36 pins, pitch 2.54mm, package size 11.5x8.5x17.5mm^3, https://www.recom-power.com/pdf/Innoline/R-78HBxx-0.5_L.pdf DCDC-Converter, RECOM, RECOM_R-78E-0.5, SIP-3, pitch 2.54mm, hole diameter 1.0mm wire loop as test Point, diameter 5.0mm z-position of LED center 3.0mm 2 pins Datasheet can be used for hall sensors, drill 0.75mm (see NXP sot054_po.pdf to-92 sc-43 sc-43a sot54 PA33 transistor TO-92 2-pin leads in-line, wide, drill 0.75mm (see NXP sot054_po.pdf TO-92 leads molded, narrow, drill 0.75mm TO-92Flat package, often used for hall sensors, drill 0.75mm (see https://www.diodes.com/assets/Package-Files/TO92L.pdf and http://www.ti.com/lit/an/snoa059/snoa059.pdf TO-92L Inline Wide transistor TO-92L leads in-line (large body variant of 8-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), LongPads 64-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, LongPads 12-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body size 6.7x21.88mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 8x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 16-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 10.8x24.42mm 9x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils 10-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 10-lead surface-mounted (SMD) DIP package, row spacing 8.89 mm (350 mils), body size 10.8x32.04mm 12x-dip-switch SPST , Piano, row spacing 7.62 mm (300 mils 16-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm.

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