Labels Milestones
Back8-lead dip package, row spacing 15.24 mm (600 mils), SMDSocket, LongPads THT DIP DIL PDIP 2.54mm 15.24mm 600mil SMDSocket SmallPads 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 4x-dip-switch SPST , Slide, row spacing 25.4 mm (1000 mils), SMDSocket, SmallPads 5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket THT DIP DIL PDIP 2.54mm 10.16mm 400mil 4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 8-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 10-lead.
- (http://www.st.com/resource/en/datasheet/tda7264.pdf TO-220-9 Vertical 2.54mm Pitch (http://www.st.com/resource/en/datasheet/tda7264.pdf TO-220-9.
- Normal -0.0285897 0.0942433 0.995139 vertex 0 10.1904 2.19603.
- Separate panel and Pin.