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9774040951 (https://katalog.we-online.de/em/datasheet/9774040951.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP8: plastic thin shrink small outline package; 44 leads; body width 16.90 mm Power-Integrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 25.4 mm (1000 mils), LongPads 10-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils.

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