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Connector, DF3EA-05P-2H (https://www.hirose.com/product/document?clcode=CL0543-0332-0-51&productname=DF3EA-5P-2H(51)&series=DF3&documenttype=2DDrawing⟨=en&documentid=0001163317), generated with kicad-footprint-generator Soldered wire connection, for 3 times outer diameter, generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 2 times 1.5 mm² wire, basic insulation, conductor diameter 2mm, size source Multi-Contact FLEXI-xV 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 2.5 mm² wires, reinforced insulation, conductor diameter 2mm, see http://www.produktinfo.conrad.com/datenblaetter/550000-574999/556444-da-01-de-LEITERPLATTENKL__PTSM_0_5__4_2_5_V_THR.pdf, script-generated with , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_Phoenix THT Terminal Block Phoenix MKDS-1,5-13-5.08 pitch 5.08mm size 71.1x11.2mm^2 drill 1.3mm pad 2.5mm terminal block RND 205-00305, 9 pins, pitch 7.5mm, size 24.8x14mm^2, drill diamater 1.3mm, pad diameter 2.5mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00298_DB_EN.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_RND THT terminal block RND 205-00076 pitch 7.5mm size 67.5x10.3mm^2 drill 1.3mm pad 2.6mm Terminal Block WAGO 236-204, 45Degree (cable under 45degree), 14 pins, single row 0.8 mm Highspeed card edge connector for PCB's with 20 contacts (polarized Highspeed card edge connector for 1.6mm PCB's with 08 contacts (polarized Highspeed card edge card connector socket for 2.36mm PCBs, vertical, alignment pins (source: https://suddendocs.samtec.com/prints/hsec8-1xxx-xx-xx-dv-x-xx-footprint.pdf 0.8 mm BGA-64, 10x10 raster, 8x8mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=267, NSMD pad definition Appendix A BGA 1156 1 FF1156 FFG1156 FFV1156 Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=277, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=296, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=91, NSMD pad definition Appendix A BGA 484 0.8 SB484 SBG484 SBV484 Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=93, NSMD pad definition Appendix A BGA 1156 1 RF1157 RF1158 Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=306, NSMD pad definition Appendix A BGA 676 1 FB676 FBG676 FBV676 Kintex-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=306, NSMD pad definition Appendix A BGA 1760 1 FH1761 FHG1761 Virtex-7 BGA.

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