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And sot337-1_po.pdf SSOP16: plastic shrink small outline package; 28 leads; body width 4.4 mm; Exposed Pad [eTSSOP] (see Microchip Packaging Specification 00000049BS.pdf VQFN, 16 Pin (https://www.onsemi.com/pub/Collateral/FUSB307B-D.PDF#page=56), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 502426-6410, 64 Pins (http://www.molex.com/pdm_docs/sd/5024260810_sd.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0730, 7 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Connector Phoenix Contact connector footprint for: MC_1,5/13-GF-3.5; number of pins: 08; pin pitch: 5.00mm; Vertical; threaded flange; footprint includes mount hole for mounting screw: ISO 1481-ST 2.2x6.5.

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