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Via insulated copper area below body, vias included (case drawing: https://ww2.minicircuits.com/case_style/CD542.pdf, land pattern PL-035, including GND-vias (https://ww2.minicircuits.com/pcb/98-pl035.pdf Footprint for Mini-Circuits case GP1212 (https://ww2.minicircuits.com/case_style/GP731.pdf) following land pattern PL-236, including GND vias (https://ww2.minicircuits.com/pcb/98-pl230.pdf Footprint for Mini-Circuits case BK377 (https://ww2.minicircuits.com/case_style/BK276.pdf Footprint for Mini-Circuits case GP731 (https://ww2.minicircuits.com/case_style/GP731.pdf Footprint for Mini-Circuits case MMM168 (https://ww2.minicircuits.com/case_style/MMM168.pdf Footprint for Mini-Circuits case YY161 (https://ww2.minicircuits.com/case_style/YY161.pdf Footprint for Mini-Circuits case QQQ130 (https://ww2.minicircuits.com/case_style/QQQ130.pdf Footprint for Mini-Circuits case GP1212 (https://ww2.minicircuits.com/case_style/GP731.pdf Footprint for the purpose of.

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