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494, 3.3x3.38mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g051f8.pdf#page=102 ST WLCSP-25, ST die ID 494, 3.3x3.38mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g051f8.pdf#page=102 ST WLCSP-25, ST die ID 450, 4.96x4.64mm, 156 Ball, 13x12 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h747xi.pdf DFN, 6 Pin (https://www.silabs.com/documents/public/data-sheets/si512-13.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole ST Morpho Connector 144 With STLink ST Morpho Connector 144 With STLink ST Morpho Connector 144 STLink AI accelerated MCU with optional wifi, https://dl.sipeed.com/MAIX/HDK/Sipeed-M1&M1W/Specifications AI Kendryte K210 RISC-V Texas Instruments HSOP 9, 1.27mm pitch, single row Surface mounted socket strip THT 2x25 1.27mm double row Through hole IDC header, 2x10, 1.00mm pitch, double rows Through hole pin header THT 2x05 2.54mm double row surface-mounted straight socket strip, 2x33, 2.00mm pitch, single row style2 pin1 right Through hole pin header THT 1x13 1.00mm single row style2 pin1 right Through hole IDC box header THT 1x12 2.00mm single row Through hole Samtec HPM power header series 11.94mm post length, 1x03, 5.08mm pitch, single row style2 pin1 right Through hole socket strip THT 2x18 1.27mm double row Through hole Samtec HPM power header series 3.81mm post length THT 1x10 2.00mm single row style2 pin1 right.

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