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Mm Power-Integrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 25.4 mm (1000 mils THT DIP DIL PDIP 2.54mm 8.89mm 350mil SMDSocket LongPads 4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 14-lead.

• SMT J bend https://dznh3ojzb2azq.cloudfront.net/products/Slide/JS/documents/datasheet.pdf.
• 4.61666 5.5107 7.08096 vertex 7.04362 -0.568952.

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