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PowerDI3333-8, Plastic Dual Flat No Lead Package - 9x9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf, http://www.onsemi.com/pub/Collateral/NCP1207B.PDF 8-Lead Plastic Small outline http://www.ti.com/lit/ml/mpds158c/mpds158c.pdf VSO40: plastic very small outline package; 24 leads; body width 4.4 mm; Exposed Pad (see https://www.diodes.com/assets/Datasheets/AP2204.pdf SSOP 0.50 exposed pad 8-Lead Plastic DFN (5mm x 5mm) (see Linear Technology DFN_8_05-08-1718.pdf DFN, 8 Pin (https://www.st.com/resource/en/datasheet/l7980.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 4.5mm, height 4, Wuerth electronics 9774030960 (https://katalog.we-online.de/em/datasheet/9774030960.pdf,), generated with kicad-footprint-generator Molex CLIK-Mate series connector, 53398-1371 (http://www.molex.com/pdm_docs/sd/533980271_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 5 times 0.75 mm² wires, reinforced insulation, conductor diameter 0.4mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-xV 2.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 0.75 mm² wire, reinforced insulation, conductor diameter 1.4mm, outer diameter 3.6mm, size source Multi-Contact FLEXI-xV 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius.

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