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BackHeight 11, Wuerth electronics 9774050482 (https://katalog.we-online.de/em/datasheet/9774050482.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 8-Lead Very Thin Dual Flatpack No-Lead (LZ) - 2x3x0.9 mm Body [SSOP] (see Microchip Packaging Specification 00000049BS.pdf DFN package size 11.6x8.5x10.4mm^3, https://www.recom-power.com/pdf/Innoline/R-78Sxx-0.1.pdf dc-dc recom buck sip-4 pitch 2.54mm size 28.4x6.2mm^2 drill 1.1mm pad 2.1mm terminal block RND 205-00088 pitch 10mm Varistor, diameter 9mm, width 5.7mm, pitch 5mm Varistor, diameter 12mm, width 7.9mm, pitch 7.5mm size 15x11mm^2 drill 1.4mm pad 2.8mm terminal block RND 205-00293 pitch 5.08mm size 15.2x11.2mm^2 drill 1.3mm pad 2.5mm terminal block RND 205-00235 pitch 5.08mm size 10.2x11mm^2 drill 1.4mm pad 2.8mm terminal block RND 205-00305 pitch 10mm Varistor, diameter 15.5mm, width 5.2mm, pitch 7.5mm Varistor, diameter 21.5mm, width 4.8mm, pitch 10mm size 105x10.3mm^2 drill 1.3mm pad 2.5mm terminal block Metz Connect Type011_RT05502HBWC pitch 5mm size 35x9mm^2 drill 1.3mm pad 2.5mm terminal block RND 205-00005, 6 pins, single row Through hole straight pin header, 1x22, 1.00mm pitch, single row Through hole angled pin header, 2x09, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight socket strip, 2x19, 1.27mm pitch, double rows Through hole straight pin header, 2x05, 1.27mm pitch, double rows Through.
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