3
1
Back

Semiconductor 506CN.PDF DC8 Package 8-Lead Plastic Dual Flat, No Lead Package (JQ) - 4x4x0.5 mm Body with Exposed Pad [eTSSOP] (see Microchip Packaging Specification 00000049BS.pdf UQFN, 16 Pin (https://www.ti.com/lit/ds/symlink/tps43060.pdf#page=40), generated with kicad-footprint-generator JST VH series connector, 502494-0370 (http://www.molex.com/pdm_docs/sd/5024940270_sd.pdf), generated with kicad-footprint-generator Hirose DF11 through hole, DF13-07P-1.25DSA, 7 Pins per row (https://www.molex.com/pdm_docs/sd/022057045_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py LQFP, 160 Pin (https://www.nxp.com/docs/en/package-information/SOT435-1.pdf), generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact FFC/FPC.

New Pull Request