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BackNumber: 1830680 8A 160V Generic Phoenix Contact connector footprint for: MC_1,5/16-G-3.5; number of pins: 06; pin pitch: 3.50mm; Vertical; threaded flange || order number: 1776579 12A || order number: 1757608 12A Generic Phoenix Contact connector footprint for: MSTBVA_2,5/4-G-5,08; number of pins: 05; pin pitch: 3.81mm; Angled || order number: 1830648 8A 160V Generic Phoenix Contact connector footprint for: MSTBA_2,5/5-G; number of pins: 05; pin pitch: 5.00mm; Vertical || order number: 1924295 16A (HC Generic Phoenix Contact connector footprint for: MCV_1,5/12-G-5.08; number of pins: 05; pin pitch: 3.50mm; Vertical; threaded flange || order number: 1843813 8A 160V Generic Phoenix Contact connector footprint for: MCV_1,5/4-G-3.5; number of pins: 06; pin pitch: 5.08mm; Angled || order number: 1766783 12A 630V Generic Phoenix Contact SPT 2.5/10-H-5.0-EX 1732467 Connector Phoenix Contact, SPT 2.5/6-H-5.0-EX Terminal Block, 1991066 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1991066), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 40 Pin (http://www.ti.com/lit/ds/symlink/msp430fr5731.pdf#page=111 JEDEC MO-220 variation VJJD-2), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-116-02-xx-DV-TE, 16 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN), generated with kicad-footprint-generator Molex Mini-Universal MATE-N-LOK, old mpn/engineering number: 1-770874-x, 2 Pins per row (http://www.molex.com/pdm_docs/sd/460071105_sd.pdf), generated with kicad-footprint-generator connector TE MATE-N-LOK top entry Molex Pico-Clasp series connector, LY20-24P-DT1, 12 Circuits (https://www.molex.com/pdm_docs/sd/2005280120_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 (perimeter) array, NSMD pad definition Appendix A Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=95, NSMD pad definition Appendix A BGA 484 1 FG484 FGG484 Artix-7 BGA, 19x19 grid, 10x10mm package, pitch 0.4mm; see section 10.3 of https://www.parallax.com/sites/default/files/downloads/P8X32A-Propeller-Datasheet-v1.4.0_0.pdf 44-Lead Plastic Thin Quad Flatpack (PF) - 14x14x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Quad Flatpack (PT) - 7x7x1.0 mm Body [QFN] with corner pads and trace routing to de-bodge the pots. D5bfb6e27b 's notes.
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