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1755781 12A || order number: 1776919 12A || order number: 1776799 12A || order number: 1924567 16A (HC Generic Phoenix Contact connector footprint for: MC_1,5/11-GF-3.81; number of pins: 07; pin pitch: 3.81mm; Angled; threaded flange || order number: 1924486 16A (HC Generic Phoenix Contact SPT 2.5/12-V-5.0-EX Terminal Block, 1732519 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1732519), generated with kicad-footprint-generator ipc_noLead_generator.py DDB Package; 12-Lead Plastic DFN (5mm x 5mm) (see Linear Technology 1956f.pdf TSSOP, 16 Pin (https://www.ti.com/lit/ds/symlink/ts5v330.pdf#page=28 QFN, 20 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/AD7682_7689.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-149-02-xxx-DV-BE-LC, 49 Pins per row (http://www.molex.com/pdm_docs/sd/428192214_sd.pdf), generated with kicad-footprint-generator ipc_plcc_jLead_generator.py PLCC, 32 Pin (http://www.issi.com/WW/pdf/61-64C5128AL.pdf), generated with kicad-footprint-generator Molex 0.50mm Pitch Easy-On BackFlip Type FFC/FPC, 502250-3391, 33 Circuits (http://www.molex.com/pdm_docs/sd/5022503391_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 44-Lead Plastic Shrink Small Outline (SN) - Narrow, 3.90 mm Body with Exposed Pad Variation BB; (see Linear Technology 05081955_0_DHC18.pdf DHD Package; 16-Lead Plastic HTSSOP (4.4x5x1.2mm); Thermal pad; (http://www.ti.com/lit/ds/symlink/drv8833.pdf HTSSOP, 16 Pin (JEDEC MO-153 Var GC https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator ipc_noLead_generator.py 8-Lead Plastic WSON, 2x2mm Body, 0.5mm Pitch, https://www.ti.com/lit/ds/symlink/dac80508.pdf Analog LFCSP, 16 Pin (JEDEC MO-194 Var AA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator ipc_noLead_generator.py Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32u575og.pdf#page=306 ST WLCSP-100, off-center ball grid, ST die ID 483, 3.73x4.15mm, 115 Ball, Y-staggered 11x21 Layout, 0.35mm Pitch, https://www.onsemi.com/pdf/datasheet/ncp163-d.pdf#page=23 6pin Pitch 0.4mm 8-Lead Plastic Dual Flat, No Lead Package - 3x3 mm Body [UDFN] (See http://www.onsemi.com/pub/Collateral/NLSV2T244-D.PDF dfn udfn dual flat OnSemi VCT, 28 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=289), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 64 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/doc7593.pdf (page 432)), generated with kicad-footprint-generator Molex CLIK-Mate series connector, 502443-0970 (http://www.molex.com/pdm_docs/sd/5024430270_sd.pdf), generated with kicad-footprint-generator Molex 734 Male header (for PCBs); Straight solder pin 1 x 1 mm, 734-143 , 13 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST ZE series connector, B16B-PHDSS (http://www.jst-mfg.com/product/pdf/eng/ePHD.pdf), generated with kicad-footprint-generator Hirose DF13 through hole, DF13-04P-1.25DS, 4 Pins per row (https://www.hirose.com/product/document?clcode=&productname=&series=DF11&documenttype=Catalog⟨=en&documentid=D31688_en), generated with.

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