3
1
Back

/ TQFP128 CASE 932BB (see ON Semiconductor 932BB.PDF 144-Lead Plastic Thin Shrink Small Outline (SN) - Narrow, 3.90 mm Body [LFCSP]; (see https://www.intersil.com/content/dam/Intersil/documents/l72_/l72.10x10c.pdf LFCSP VQ, 48 pin, exposed pad: 4.5x8.1mm, (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-12-11/ PowerPAK SO-8L Single (https://www.vishay.com/docs/64721/an913.pdf SOP, 16 Pin (https://www.nxp.com/docs/en/package-information/SOT758-1.pdf), generated with kicad-footprint-generator Through hole angled pin header, 2x34, 2.00mm pitch, double rows Surface mounted pin header THT 1x40 1.27mm single row Through hole pin header THT 2x01 1.00mm double row surface-mounted.

New Pull Request