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OPIC IS485 IS486 package for Everlight ITR1201SR10AR, light-direction upwards, see https://www.everlight.com/file/ProductFile/ITR1201SR10AR-TR.pdf reflective opto couple photo coupler IR Receiver Vishay TSOP-xxxx, MOLD package, see https://www.vishay.com/docs/82669/tsop32s40f.pdf IR Receiver Vishay TSOP-xxxx, CAST package, see https://www.vishay.com/docs/82669/tsop32s40f.pdf IR Receiver Vishay TSOP-xxxx MINIMOLD IR Receiver Vishay TSOP-xxxx, MOLD package, see https://www.vishay.com/docs/82493/tsop311.pdf package for Standex Meder SIL reed relais Standex-Meder SIL-relais, Form 1C, see https://standexelectronics.com/wp-content/uploads/datasheet_reed_relay_SIL.pdf Standex-Meder SIL-relais, Form 1B, see https://standexelectronics.com/wp-content/uploads/datasheet_reed_relay_SIL.pdf Miniature PCB Relay, PCH Series, 1 Form A http://image.schrack.com/datenblaetter/h_rp810012-b.pdf Relay SPST Schrack-RP3SL, 1-coil-version, RM5mm 16A 250V AC Form A Relay SPST Schrack-RT1 RM3.5mm 8A 250V AC Relay Relay SPST Schrack-RT1 RM5mm 16A 250V AC Relay Relay SPST Schrack-RP3SL RM5mm 16A 250V AC Relay Relay SPST Schrack-RP-II/1 RM5mm 8A 250V AC Relay Finder 32.21-x000 Relay, DPDT, https://omronfs.omron.com/en_US/ecb/products/pdf/en-g2rl.pdf Omron G5V-2 Relay DPDT IM-relay FRT5 Kemet signal relay, DPDT, non-latching, single coil latching through hole M3, height 11, Wuerth electronics 9775096360 (https://katalog.we-online.com/em/datasheet/9775096360.pdf), generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, 105309-xx06, 6 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator JST ZE series connector, S16B-J21DK-GGXR (http://www.jst-mfg.com/product/pdf/eng/eJFA-J2000.pdf), generated with kicad-footprint-generator JST PHD series connector, 202396-0707 (http://www.molex.com/pdm_docs/sd/2023960207_sd.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: A-41792-0008 example for new mpn: 39-28-x08x, 4 Pins (http://www.molex.com/pdm_docs/sd/559350530_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Texas instruments QFN Package, datasheet: https://www.ti.com/lit/ds/symlink/tpsm53602.pdf Texas Instruments, BGA Microstar Junior, 5x5mm, 80 ball 9x9 grid, NSMD pad definition Appendix A BGA 400 0.8 CLG400 CL400 Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=294, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=90, NSMD pad definition Appendix A Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=264, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments DSBGA BGA YZR0009 Texas Instruments, DSBGA, area grid, NSMD, YZP0005 pad definition, 0.8875x1.3875mm, 5 Ball, 2x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l4p5ve.pdf ST WLCSP-115, ST die ID 464, 2.58x3.07mm, 36 Ball, 6x6 Layout, 0.5mm Pitch, DSC0010J, WSON, http://www.ti.com/lit/ds/symlink/tps61201.pdf Plastic Small Outline (SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true SO, 8 Pin (https://ww2.minicircuits.com/case_style/XX112.pdf), generated with kicad-footprint-generator Hirose DF11 through hole, DF11-16DP-2DSA, 8 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Soldered wire connection, for 4 times 1 mm² wires, reinforced insulation, conductor diameter 1.25mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-xV 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Soldered wire connection, for a single 0.75 mm² wires, basic insulation, conductor diameter 0.9mm, outer diameter 3.6mm, size source Multi-Contact.

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