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23x23 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST TFBGA-225, 13.0x13.0mm, 225 Ball, 15x15 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST TFBGA-361, 12.0x12.0mm, 361 Ball, 23x23 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST TFBGA-361, 12.0x12.0mm, 361 Ball, 23x23 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf ST WLCSP-100, ST die ID 482, 4.2x3.95mm, 90 Ball, X-staggered 7x5 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF NXP VFBGA-42, 3.0x2.6mm, 42 Ball, 6x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32u575og.pdf#page=306 ST WLCSP-100, off-center ball grid, ST die ID 483, 3.73x4.15mm, 115 Ball, Y-staggered 11x21 Layout, 0.35mm Pitch, https://www.onsemi.com/pdf/datasheet/ncp163-d.pdf#page=23 6pin Pitch 0.4mm http://www.ti.com/lit/ds/symlink/txb0108.pdf USON-20 2x4mm Pitch 0.4mm http://www.chip.tomsk.ru/chip/chipdoc.nsf/Package/C67E729A4D6C883A4725793E004C8739!OpenDocument WSON-16 3.3 x 1.35mm Pitch 0.4mm 8-Lead Plastic Dual Flat, No Lead Package (MF) - 6x5 mm Body [SSOP] (see Microchip Packaging Specification 00000049BS.pdf, http://www.onsemi.com/pub/Collateral/NCP1207B.PDF 8-Lead Plastic DFN (5mm x 5mm) (see http://www.everspin.com/file/236/download DFN8 2x2, 0.5P; CASE 506CN (see ON Semiconductor 506AF.PDF DKD Package; 32-Lead Plastic Thin Shrink Small Outline Narrow Body (QR)-.150" Body [QSOP] (see Microchip Packaging Specification 00000049BS.pdf, http://www.onsemi.com/pub/Collateral/NCP1207B.PDF 8-Lead Plastic Dual Flat, No Lead Package - 4.0x4.0x0.8 mm Body [LFCSP], (see http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_20_6.pdf LFCSP, 20 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0108.PDF U20E-1), generated with kicad-footprint-generator JST SUR series connector, SM06B-SURS-TF (http://www.jst-mfg.com/product/pdf/eng/eSUR.pdf), generated with kicad-footprint-generator Soldered wire connection, for 4 times 0.75 mm² wires, basic insulation, conductor diameter 2.4mm, see http://www.4uconnector.com/online/object/4udrawing/10689.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_WAGO THT Terminal Block Phoenix PT-1,5-9-3.5-H pitch 3.5mm size 21x6.5mm^2 drill 1.2mm pad 3mm Terminal Block Phoenix MKDS-1,5-16 pitch 5mm size 36.5x15mm^2 drill 1.2mm pad 3mm Terminal Block 4Ucon ItemNo. 10690, 13 pins, pitch 3.81mm, size 15.1x7.3mm^2, drill diamater 1.3mm, pad diameter 2.6mm, see http://www.farnell.com/datasheets/100425.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_RND THT terminal block RND 205-00050 pitch 5mm size 15x7.6mm^2 drill 1.3mm pad 2.5mm terminal block connector http://www.phoenixcontact.com/us/products/1778748/pdf PhoenixContact PTSM0,5 8 2,5mm vertical SMD spring clamp terminal block Metz Connect Type067_RT01902HDWC pitch 10mm size 85x10.3mm^2 drill 1.3mm pad 2.5mm terminal block RND 205-00234, 4 pins, pitch 5mm, size 62.3x14mm^2, drill diamater 1.1mm, pad diameter 2.5mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00078_DB_EN.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_MetzConnect THT terminal block RND 205-00049 pitch 5mm size 50x9mm^2.

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