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KingTek_DSHP02TJ, Slide, row spacing 16.51 mm (650 mils), SMDSocket, SmallPads 64-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 12-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 12-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils THT DIP DIL PDIP 2.54mm 7.62mm 300mil 2x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size 6.7x16.8mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 2x-dip-switch SPST KingTek_DSHP02TS, Slide, row spacing 6.15 mm (242 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/cvs.pdf SMD 2x-dip-switch SPST Copal_CHS-02B, Slide, row spacing 7.62 mm (300 mils), body size 6.7x24.42mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 2x-dip-switch SPST CTS_Series194-2MSTN, Piano, row spacing 25.4 mm (1000 mils), Socket 8-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils THT DIP DIL PDIP 2.54mm 10.16mm 400mil SMDSocket SmallPads 40-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 4x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 6x-dip-switch SPST KingTek_DSHP06TS, Slide, row spacing 22.86 mm (900 mils THT DIP DIL PDIP 2.54mm 11.43mm 450mil SMDSocket LongPads 64-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, LongPads 12-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 20-lead surface-mounted (SMD) DIP package, row spacing 8.61 mm (338 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 6x-dip-switch SPST , Slide, row spacing 16.51 mm (650 mils), SMDSocket, SmallPads 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf PowerIntegrations variant of 8-lead though-hole mounted high-volatge DIP package (based on http://www.latticesemi.com/view_document?document_id=213 Lattice caBGA-756, ECP5 FPGAs, 27.0x27.0mm, 756 Ball, 32x32 Layout, 0.8mm Pitch, http://www.latticesemi.com/view_document?document_id=213 Analog Devices KS-4 (like EIAJ SC-82 Infineon PG-HDSOP-10-1 (DDPAK), 20.96x6.5x2.3mm, slug up (https://www.infineon.com/cms/en/product/packages/PG-HDSOP/PG-HDSOP-10-1/ HSOF-8-1 [TOLL] power MOSFET (http://www.infineon.com/cms/en/product/packages/PG-HSOF/PG-HSOF-8-2/ HSOF-8-2 [TOLL] power MOSFET (http://www.infineon.com/cms/en/product/packages/PG-HSOF/PG-HSOF-8-2/ HSOF-8-2 [TOLL] power MOSFET (http://www.infineon.com/cms/en/product/packages/PG-HSOF/PG-HSOF-8-2/, https://www.infineon.com/dgdl/Infineon-ApplicationNote_600V_CoolMOS_C7_Gold_TOLL-AN-v01_00-EN.pdf?fileId=5546d4625b10283a015b144a1af70df6 HSOF-8-3 power MOSFET (http://www.infineon.com/cms/en/product/packages/PG-HSOF/PG-HSOF-8-1/ mosfet hsof toll thermal vias with large copper area, as proposed in http://www.ti.com/lit/ds/symlink/tps5430.pdf TSOP-I, 24 Pin (https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf), generated with kicad-footprint-generator Hirose DF12E SMD, DF12E3.0-20DP-0.5V, 20 Pins (https://www.molex.com/pdm_docs/sd/537480308_sd.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 5273-11A example for new part number: 26-60-5140, 14 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13-2P-1.25DSA%2850%29/), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective.

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