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Series, http://cdn-reichelt.de/documents/datenblatt/B400/XO53.pdf, hand-soldering, 5.0x3.2mm^2 package 14-lead dip package, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 32-lead dip package, row spacing 7.62 mm (300 mils), Socket 18-lead though-hole mounted DIP package, row.

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