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Package, http://optoelectronics.liteon.com/upload/download/DS86-2013-0004/LTR-303ALS-01_DS_V1.pdf Optoisolator with LED and photoresistor 3 Lead Plastic Package OnSemi CASE 100AQ for QRE1113, see https://www.onsemi.com/pub/Collateral/QRE1113-D.PDF OnSemi CASE 100AQ for QRE1113, see https://www.onsemi.com/pub/Collateral/QRE1113-D.PDF OnSemi CASE 100CY, light-direction upwards, see http://www.kodenshi.co.jp/products/pdf/sensor/photointerrupter_ref/SG-105.pdf Laser Diode, TO-38-ICut, 3pin Laser Diode, TO18-like (D=5.6mm), 3pin Laser Diode, TO-38-ICut, 3pin Laser Diode, TO-38-ICut, 3pin Laser Diode, TO18-like (D=5.6mm), 3pin Laser Diode, TO-38-ICut, 3pin Laser Diode, TO-3.3mm, 3pin Laser Diode, TO-38-ICut, 3pin Laser Diode, TO-38-ICut, 3pin Laser Diode, TO-38-ICut, 3pin Laser Diode, TO-3.3mm, 3pin Laser Diode, TO18-like (D=5.6mm), 3pin Laser Diode, TO-3.3mm, 3pin Laser Diode, TO-3.3mm, 3pin Laser Diode, TO5-like (D=9mm), 3pin Laser Diode, TO-38-ICut, 3pin Laser Diode, TO5-like (D=9mm), 3pin Laser Diode, TO-56, 3pin lightpipe triple tower right angle right angle tact switch https://www.e-switch.com/system/asset/product_line/data_sheet/148/TL1250.pdf led push switch right angle through hole M3, height 11.6, Wuerth electronics 9774020960 (https://katalog.we-online.de/em/datasheet/9774020960.pdf,), generated with kicad-footprint-generator connector wire 0.1sqmm strain-relief Soldered wire connection with double feed through strain relief, for 3 times 0.1 mm² wires, reinforced insulation, conductor diameter 1.25mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-2V 0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-143-02-xxx-DV-BE, 43 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 20-Lead Frame Chip Scale Package - 9x9 mm Body [SOIC], see https://www.mouser.com/ds/2/328/linkswitch-pl_family_datasheet-12517.pdf eSOP-12B SMT Flat Package with Heatsink Tab, see https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations E Package eSIP-7F Flat Package with Heatsink Tab, https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations eDIP-12B, see https://www.power.com/sites/default/files/product-docs/linkswitch-pl_family_datasheet.pdf 4-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size 6.7x11.72mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 6x-dip-switch SPST , Slide, row spacing 25.4 mm (1000 mils), Socket 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf Power Integrations K Package PowerPAK SO-8 Single (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72599/72599.pdf 16-Lead Plastic Shrink Small Outline (SS)-5.30 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf TQFP, 144 Pin (https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/packaging/04r00487-01.pdf), generated with kicad-footprint-generator Molex Pico-EZmate side entry Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 55560-0221, 22 Pins.

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