3
1
Back

Technology DFN_16_05-08-1732.pdf DHC Package; 16-Lead Plastic Small Outline Package (MS) [MSOP], variant of 8-Lead Plastic DFN (2mm x 2mm) 0.40mm pitch DDB Package; 10-Lead Plastic Dual Flat, No Lead Package (MF) - 3.3x3.3x1 mm Body [TQFP] With Exposed Pad (see Microchip datasheet http://ww1.microchip.com/downloads/en/DeviceDoc/mic5355_6.pdf MLF, 20 Pin (http://www.ti.com/lit/ds/symlink/opa569.pdf, http://www.ti.com/lit/an/slma004b/slma004b.pdf), generated with kicad-footprint-generator Molex Mini-Fit Sr. Power Connectors, 105309-xx02, 2 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Hirose DF11 through hole, DF13-13P-1.25DSA, 13 Pins (https://www.molex.com/pdm_docs/sd/026605050_sd.pdf), generated with kicad-footprint-generator connector Molex Nano-Fit Power Connectors, old mpn/engineering.

New Pull Request