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Back2024 Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains T1 3.200mm 0.1260" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole) T3 7.000mm 0.2756" (6 holes T4 10.000mm 0.3937" (4 holes) (with 4 slots T2 5.000mm 0.1969" (1 hole Total plated holes count 16 ============================================================= Total unplated holes count 16 Not plated through holes are merged with plated holes unplated through holes: merged pull request 'pcb_finalization' (#1) from bugfix/10hp into main Merge pull request 'new_footprints' (#5) from new_footprints into main afea9d5a2cf23e2a33a2927086270d4d602f5a2b Final revision; added custom DRC as project file tstamp 62e17d71-a82e-47f7-8a14-a0885fbe0008) Final revision; added custom DRC as project file new_footprints Added.
- Spring contact emi emc.
- 5.40904 7.37319 vertex 6.94378 -0.693269 7.20613 vertex 5.23815.
- 2x02 2.00mm double row surface-mounted straight pin header.
- 0.449666 0.705399 vertex -8.10352 5.4146 3.26879 facet normal.
- (https://katalog.we-online.com/em/datasheet/9775076360.pdf), generated with kicad-footprint-generator Samtec HLE .100.