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00000049BS.pdf UQFN, 20 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-100172.PDF), generated with kicad-footprint-generator Molex Mini-Fit Sr. Power Connectors, old mpn/engineering number: 1-794071-x, 11 Pins per row (http://www.molex.com/pdm_docs/sd/439151404_sd.pdf), generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact FFC/FPC, 200528-0150, 15 Circuits (https://www.molex.com/pdm_docs/sd/2005280150_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 56 Pin (http://intantech.com/files/Intan_RHD2000_series_datasheet.pdf#page=38), generated with kicad-footprint-generator connector JST PHD series connector, S32B-PHDSS (http://www.jst-mfg.com/product/pdf/eng/ePHD.pdf), generated with kicad-footprint-generator connector Hirose FH41 horizontal Molex MicroClasp Wire-to-Board System, 55935-1010, with PCB locator, 13 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py HTSSOP, 24 Pin (http://www.ti.com/lit/ds/symlink/bq25601.pdf#page=54), generated with kicad-footprint-generator ipc_noLead_generator.py 16-Lead Ultra Thin Plastic Quad Flat, No Lead Package, 1.2x1.8x1.55 mm Body [SSOP] (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Shrink Small Outline (SS)-5.30 mm Body [SSOP] (http://cds.linear.com/docs/en/datasheet/680313fa.pdf SSOP, 48 Pin (JEDEC MO-241/VAC, https://assets.nexperia.com/documents/package-information/SOT764-1.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py HTSSOP, 24 Pin (http://www.ti.com/lit/ds/symlink/tps703.pdf), generated with kicad-footprint-generator Hirose series connector, BM07B-GHS-TBT (http://www.jst-mfg.com/product/pdf/eng/eGH.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for a single 2.5 mm² wires, basic insulation, conductor diameter 0.5mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-xV 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex CLIK-Mate series connector, B8B-XH-A (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator Fuse SMD 1206 https://ww2.minicircuits.com/case_style/FV1206-7.pdf SMD Type 10.7MHz Ceramic Filter https://www.murata.com/en-us/products/filter/cerafil/sfecf 6-pin 3.8 x 3.8mm SAW filter package - 1.1x0.9 mm Body; (see https://www.murata.com/~/media/webrenewal/support/library/catalog/products/filter/rf/p73e.ashx?la=en-gb 5-pin filter package based on http://www.latticesemi.com/view_document?document_id=213 Lattice caBGA-756, ECP5 FPGAs, 27.0x27.0mm, 756 Ball, 32x32 Layout, 0.8mm Pitch, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-bga/05081600_0_bga49.pdf https://www.analog.com/media/en/technical-documentation/product-information/assembly-considerations-for-umodule-bga-lga-package.pdf BGA 324 0.8 GateMate FPGA Maxim WLP-12, W121H2+1, 2.008x1.608mm, 12 Ball, 3x4 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/tps63000.pdf 3x3mm Body, 0.5mm Pitch, 0.3mm Ball, http://www.st.com/resource/en/datasheet/stm32l486qg.pdf UFBGA-144, 12x12 raster, 10x10mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f401vc.pdf WLCSP-49, 7x7 raster, 3.417x3.151mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/DM00340475.pdf WLCSP-66, 9x9 raster, 4x4mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/DM00340475.pdf WLCSP-66, 9x9 raster, 3.639x3.971mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l152zd.pdf WLCSP-64, 8x8 raster, 3.357x3.657mm package, pitch 0.8mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l152ze.pdf WLCSP-143, 11x13 raster, 4.521x5.547mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/DM00257211.pdf WLCSP-64, 8x8 raster, 3.623x3.651mm package, pitch 0.35mm; https://datasheets.maximintegrated.com/en/ds/MAX40200.pdf WLP-9, 1.448x1.468mm, 9 Ball, 3x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb15cc.pdf#page=119 ST WLCSP-52, ST die ID 471, 4.437x4.456mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l562ce.pdf ST WLCSP-90, ST die ID 480, 4.57x4.37mm, 132 Ball, 12x11.

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