X="4.6" y="2.45"/> Level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15. S3B-XH-A-1 (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator Molex. 30x9.8mm^2 drill 1.3mm pad 2.6mm Terminal Block. Header, 2x34, 1.27mm pitch, double rows Through. 1.pdf More SR1 notation bacdac34d7 Add more note. New Pull Request
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