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Http://www.chip.tomsk.ru/chip/chipdoc.nsf/Package/C67E729A4D6C883A4725793E004C8739!OpenDocument WSON-16 3.3 x 1.35mm Pitch 0.4mm http://www.chip.tomsk.ru/chip/chipdoc.nsf/Package/C67E729A4D6C883A4725793E004C8739!OpenDocument WSON-16 3.3 x 1.35mm Pitch 0.4mm WLCSP WLCSP/XFBGA 8-pin package, staggered pins, http://www.adestotech.com/wp-content/uploads/DS-AT25DF041B_040.pdf WLCSP WLCSP-8 XFBGA XFBGA-8.

• Angle through hole 2.7mm, height 1.5, Wuerth.
• 1-826576-6, 16 Pins (http://www.molex.com/pdm_docs/sd/022272021_sd.pdf), generated with kicad-footprint-generator Molex.
• Key: REP: repique MSD: mid surdo (sometimes MS1.

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