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0.65 thermal pad TSSOP HTSSOP 0.65 thermal pad TSSOP HTSSOP 0.65 thermal pad (http://www.analog.com/media/en/technical-documentation/data-sheets/AD9852.pdf 80-Lead Plastic Thin Quad Flatpack (PF) - 14x14x1 mm Body, 2.00 mm Footprint [TQFP] thermal pad (CP-16-22, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_16_22.pdf LFCSP, 16 Pin (https://www.diodes.com/assets/Datasheets/PAM8403.pdf), generated with kicad-footprint-generator JST EH series connector, SM13B-SRSS-TB (http://www.jst-mfg.com/product/pdf/eng/eSH.pdf), generated with kicad-footprint-generator Molex PicoBlade Connector System, 43045-2400 (alternative finishes: 43045-042x), 2 Pins (http://www.molex.com/pdm_docs/sd/559320210_sd.pdf), generated with kicad-footprint-generator Molex Mini-Universal MATE-N-LOK, old mpn/engineering number: 5569-18A1, example for new part number: 5273-08A example for new part number.

[UQFN]; (see Microchip Packaging Specification 00000049BS.pdf.
Vertex 5.14703 0 18.8084 vertex.
42820-62XX, With thermal vias in pads.

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