Labels Milestones
BackSSOP14: plastic shrink small outline package; 10 leads; body width 4.4 mm (http://toshiba.semicon-storage.com/info/docget.jsp?did=30523&prodName=TBD62783APG SSOP20: plastic shrink small outline package; 44 leads; body width 4.4 mm; (see NXP sot054_po.pdf TO-92 leads molded, wide, drill 0.75mm, hand-soldering variant with enlarged pads (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot371-1_po.pdf STC SOP, 16 Pin (https://www.vishay.com/docs/83513/tcmd1000.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py WSON, 8 Pin (https://www.onsemi.com/pub/Collateral/NUF4401MN-D.PDF#page=6), generated with kicad-footprint-generator JST PUD series connector, B10B-XASK-1 (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-147-02-xx-DV-PE-LC, 47 Pins per row (http://www.molex.com/pdm_docs/sd/431605304_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 4-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 22.86mm 900mil 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 5-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads 10-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 14-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads THT DIP DIL PDIP SMDIP 2.54mm 11.48mm 451mil 6-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), LongPads THT DIP DIL PDIP 2.54mm 11.43mm 450mil SMDSocket LongPads 42-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, LongPads 5-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 18-lead though-hole mounted DIP package, row spacing 5.08 mm (200 mils), body size 9.78x12.34mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 9x-dip-switch SPST , Slide, row spacing 25.4 mm (1000 mils 64-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 24-lead surface-mounted (SMD) DIP package, row spacing 8.89 mm (350 mils), body size 6.7x26.96mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD DIP DIL PDIP 2.54mm 10.16mm 400mil.
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