Labels Milestones
BackWLCSP-100, ST die ID 460, 2.3x2.48mm, 25 Ball, 5x5 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100168.PDF XBGA-121, 11x11 raster, 10x10mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32f446ze.pdf UFBGA-169, 13x13 raster, 7x7mm package, pitch 0.4mm; see section 6.3 of.
- 121-ball, 0.8mm BGA (based on http://www.latticesemi.com/view_document?document_id=213 Lattice caBGA-756.
- Vertex -6.260352e+000 -3.300258e+000 9.983999e+000.