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BackMac stuff *.DS_Store # Emacs temps *~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains plated through holes are merged with plated holes Total unplated holes count 16 ============================================================= Total unplated.
- Gnd fill db7d02719b68f4d2f81a25d8b6527257f18cc3a1 Embiggen traces.
- 4.37272 7.67586 facet normal 0.615692.
- Diameter=6.3mm, height=7mm, Non-Polar Electrolytic Capacitor CP, Radial series.