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Size 11.2x7mm^2 drill 1.2mm pad 3mm Terminal Block Phoenix PT-1,5-15-3.5-H, 15 pins, pitch 5mm, size 122x15mm^2, drill diamater 1.3mm, pad diameter 2.1mm, size source Multi-Contact FLEXI-E 0.15 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 0.1 mm² wire, reinforced insulation, conductor diameter 0.5mm, outer diameter 1.7mm, outer diameter 1mm, size source Multi-Contact FLEXI-xV 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex SPOX horizontal Molex Pico-Lock series connector, B2B-EH-A (http://www.jst-mfg.com/product/pdf/eng/eEH.pdf), generated with kicad-footprint-generator connector Molex Micro-Fit_3.0 top entry JST SH series connector, B13B-XASK-1-A (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py DDB Package; 10-Lead Plastic DFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic Shrink Small Outline (SSO/Stretched SO), see https://www.vishay.com/docs/83831/lh1533ab.pdf SSO Stretched SO SOIC 1.27 SSO, 7 Pin Double Sided Module Texas Instruments DSBGA BGA YZP R-XBGA-N8 Texas Instruments, DSBGA, 3.0x1.9x0.625mm, 28 ball 7x4 area grid, NSMD pad definition Appendix A Kintex-7 and Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=276, NSMD pad definition Appendix A Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=306, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments DSBGA BGA YZP R-XBGA-N6 Texas Instruments, RWH0032A, 8x8x0.9mm (http://www.ti.com/lit/ds/snosd10c/snosd10c.pdf DFN, 10 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/3471fb.pdf#page=15), generated with kicad-footprint-generator Mounting Hardware, inside through hole M3, height 9.6, Wuerth electronics 9774110360 (https://katalog.we-online.de/em/datasheet/9774110360.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-1030, 10 Pins (http://www.molex.com/pdm_docs/sd/559350210_sd.pdf), generated with kicad-footprint-generator JST ACH series connector, B12B-PUDSS (http://www.jst-mfg.com/product/pdf/eng/ePUD.pdf), generated with kicad-footprint-generator JST VH top entry ATA PATA IDE 5.25 inch floppy drive power USB 3.0, type A, right angle USB TYPE C, RA RCPT PCB, SMT, http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ117928.pdf USB C Type-C Receptacle SMD USB Micro-B horizontal SMD USB Micro-B horizontal SMD USB 2.0 Type B SMT Horizontal 5 Contacts (https://katalog.we-online.de/em/datasheet/65100516121.pdf Mini USB 2.0 receptacle type B, horizontal version, through-hole, https://downloads.lumberg.com/datenblaetter/en/2411_02.pdf USB B receptable with flange, bottom-mount, SMD, right-angle (http://en.connfly.com/static/upload/file/pdf/DS1104-01.pdf USB 3.0 Micro B horizontal dustproof waterproof IP67 XKB Connectivity, USB Micro-B, right-angle.

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