synth_tools

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TSSOP, 50 Pin (JEDEC MO-153 Var BF https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator ipc_gullwing_generator.py TSOP-I, 32 Pin (https://www.renesas.com/eu/en/package-image/pdf/outdrawing/l32.4x4a.pdf), generated with kicad-footprint-generator Molex Pico-Clasp series connector, S7B-PH-SM4-TB (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator Mounting Hardware, inside blind hole M1.6, height 1, Wuerth electronics 9774040482 (https://katalog.we-online.de/em/datasheet/9774040482.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-149-02-xxx-DV, 49 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-140-02-xxx-DV-LC, 40 Pins (http://www.molex.com/pdm_docs/sd/555600207_sd.pdf), generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On Type FFC/FPC Connector, For LVDS, 6.05mm Height, Vertical, Surface Mount, ZIF, 33 Circuits (http://www.molex.com/pdm_docs/sd/5022441530_sd.pdf molex FFC/FPC connector Pitch 0.5mm LFCSP, 16 Pin (http://www.thatcorp.com/datashts/THAT_1580_Datasheet.pdf), generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, 43915-xx06, With thermal vias in pads, 5 Pins per row (http://www.molex.com/pdm_docs/sd/431605304_sd.pdf), generated with kicad-footprint-generator JST XH series connector, BM12B-GHS-TBT (http://www.jst-mfg.com/product/pdf/eng/eGH.pdf), generated with kicad-footprint-generator ipc_qfp_generator.py 64-Lead Plastic Quad Flat, No Lead Package (MF) - 3x3x0.9 mm Body [SOIC], pin 7 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 12-lead though-hole mounted DIP package, row spacing 5.25 mm (206 mils), body size 6.7x14.26mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 6x-dip-switch SPST Copal_CHS-06A, Slide, row spacing 6.73 mm (264 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 7x-dip-switch SPST , Piano, row spacing 7.62 mm (300 mils), Socket, LongPads 6-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, SmallPads THT DIP DIL ZIF 25.4mm 1000mil Socket LongPads 40-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 10-lead surface-mounted (SMD) DIP package, row spacing 25.4 mm (1000 mils), SMDSocket, LongPads 48-lead though-hole mounted high-volatge DIP package (based on http://www.latticesemi.com/view_document?document_id=213 BGA 0.8mm 9mm 121 BGA-132 11x17 12x18mm 1.0pitch Altera BGA-144 M144 MBGA Altera VBGA V81 BGA-81 Altera BGA-100 M100 MBGA 121-ball, 0.8mm BGA (based on standard DIP-4), row spacing 15.24 mm (600 mils), SMDSocket.

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