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Diameter 1.5mm THT pad as test Point, square 2.5mm side length SMD pad rectangle square THT rectangular pad as test Point, square 1.0mm side length SMD rectangular pad as test Point, diameter 3.0mm SMD pad as test Point, square 3.0mm side length, hole diameter 0.7mm THT pad as test point, pitch 6.35mm, hole diameter 2.0mm 2 pins LED diameter 10.0mm 3 pins diameter 3.0mm 2 pins LED_Rectangular, Rectangular, Rectangular size 5.0x2.0mm^2 3 pins U-DFN2510-10 package used by Diodes Incorporated PowerDI3333-8, Plastic Dual Flat, No Lead Package, 1.2x1.8x1.55 mm Body [QFN]; (see Microchip Packaging Specification 00000049BS.pdf 8-Lead Plastic VSON, 3x3mm Body, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST TFBGA-361, 12.0x12.0mm, 361 Ball, 23x23 Layout, 0.5mm Pitch, https://www.nxp.com/docs/en/package-information/98ASA00869D.pdf#page=1 MAPBGA 14x14x1.18 PKG, 14.0x14.0mm, 289 Ball, 17x17 Layout, 0.8mm Pitch, https://www.infineon.com/cms/en/product/packages/PG-LFBGA/PG-LFBGA-292-11/ LFBGA-100, 10x10 raster, 4.775x5.041mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f469ni.pdf WLCSP-180, 13x14 raster, 5.537x6.095mm package, pitch 0.8mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f746zg.pdf TFBGA-100, 10x10, 9x9mm package, pitch 0.4mm; see section 7.1.1 of http://www.st.com/resource/en/datasheet/stm32f401ce.pdf WLCSP-49, 7x7 raster, 3.89x3.74mm package, pitch 0.4mm; see.

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