3
1
Back

18-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), LongPads 16-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), SMDSocket, LongPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD SMD 10x-dip-switch SPST , Piano, row spacing 15.24 mm (600 mils 48-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), SMDSocket, SmallPads 18-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 9x-dip-switch SPST , Piano, row spacing 7.62 mm (300 mils), LongPads 16-lead though-hole mounted DIP package, row spacing.

New Pull Request