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BackLead pitch 0.635; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot190-1_po.pdf VSSOP-8 2.3x2mm Pitch 0.5mm Fairchild-specific MicroPak2-6 1.0x1.0mm Pitch 0.35mm https://www.nxp.com/docs/en/application-note/AN10343.pdff Fairchild-specific MicroPak-6 1.0x1.45mm Pitch 0.5mm vertical Molex KK 396 Interconnect System, old/engineering part number: 26-60-5080, 8 Pins (http://www.molex.com/pdm_docs/sd/908140004_sd.pdf), generated with kicad-footprint-generator Molex PicoBlade Connector System, 43045-0221 (alternative finishes: 43045-200x), 10 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with.
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