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ST TFBGA-225, 13.0x13.0mm, 225 Ball, 15x15 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=24 FBGA-78, 10.5x8.0mm, 78 Ball, 9x13 Layout, 0.8mm Pitch, http://www.latticesemi.com/view_document?document_id=213 WLCSP-16 2.225x2.17mm, 2.17x2.225mm, 16 Ball, 4x4 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/ts3a24159.pdf Texas Instruments, DSBGA, area grid, YBG pad definition, https://www.ti.com/lit/ds/symlink/lmg1020.pdf, https://www.ti.com/lit/ml/mxbg078z/mxbg078z.pdf BGA 6 0.4 YFF0006 Texas Instruments, DSBGA, area grid, NSMD, YZP0005 pad definition, 1.468x0.705mm, 8 Ball, 2x4 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g031y8.pdf ST WLCSP-20, ST die ID 472, 4.36x4.07mm, 81 Ball, 9x9 Layout, 0.5mm Pitch, DSC0010J, WSON, http://www.ti.com/lit/ds/symlink/tps61201.pdf Plastic Small Outline Package (MS) [MSOP], variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 64-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 16-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 5x-dip-switch SPST KingTek_DSHP05TS, Slide, row spacing 10.16 mm (400 mils THT DIP DIL PDIP 2.54mm 22.86mm 900mil 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads THT DIP DIL ZIF 15.24mm 600mil SMDSocket SmallPads 4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD SMD 10x-dip-switch SPST Copal_CHS-10A, Slide, row spacing 7.62 mm (300 mils 28-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, LongPads 64-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 9.78x14.88mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 8x-dip-switch SPST , Slide, row spacing 24.13 mm (950 mils), SMDSocket, SmallPads 28-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 3x-dip-switch SPST Copal_CVS-03xB, Slide, row spacing 7.62 mm (300 mils), body size 6.7x26.96mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 6x-dip-switch SPST , Slide, row spacing 16.51 mm (650 mils), SMDSocket, LongPads 14-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 20-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket THT DIP DIL PDIP SMDIP 2.54mm 15.24mm 600mil Socket 3M 14-pin zero insertion force socket, through-hole, row spacing 15.24 mm (600 mils), SMDSocket, LongPads 5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 22-lead though-hole mounted DIP package, row spacing 5.08 mm (200 mils.

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