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Number: 1924415 16A (HC Generic Phoenix Contact connector footprint for: MCV_1,5/11-G-3.5; number of pins: 14; pin pitch: 5.08mm; Angled; threaded flange; footprint includes mount hole for mounting screw: ISO 1481-ST 2.2x6.5 C or ISO 7049-ST 2.2x6.5 C (http://www.fasteners.eu/standards/ISO/7049/) || order number: 1776508 12A || order number: 1924169 16A (HC Generic Phoenix Contact connector footprint for: MCV_1,5/6-G-3.5; number of pins: 06; pin pitch: 3.81mm; Vertical || order number: 1830651 8A 160V Generic Phoenix Contact connector footprint for: MSTB_2,5/4-GF-5,08; number of pins: 08; pin pitch: 3.81mm; Vertical || order number: 1776728 12A || order number: 1924499 16A (HC Generic Phoenix Contact connector footprint for: GMSTBV_2,5/5-GF-7,62; number of pins: 02; pin pitch: 3.81mm; Angled; threaded flange || order number: 1776951 12A || order number: 1757349 12A || order number: 1777183 12A Generic Phoenix Contact SPT 5/11-H-7.5-ZB 1719286 Connector Phoenix Contact, SPT 2.5/4-H-5.0-EX Terminal Block, 1719189 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1719189), generated with kicad-footprint-generator Mounting Hardware, inside through hole ST Morpho Connector 144 With STLink ST Morpho Connector 144 STLink AI accelerated MCU with optional wifi, https://dl.sipeed.com/MAIX/HDK/Sipeed-M1&M1W/Specifications AI Kendryte K210 RISC-V Texas Instruments DSBGA BGA YZP R-XBGA-N8 Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 4x3 grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, area grid, NSMD pad definition Appendix A BGA 676 1 FG676 FGG676 Spartan-7 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=278, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=92, NSMD pad definition Appendix A BGA 225 0.8 CLG225 Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=268, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole socket strip THT 1x07 5.08mm single row Through hole straight pin header, 1x37, 1.00mm pitch, 2.0mm pin length, single row style1 pin1 left Surface mounted pin header THT 1x17 2.00mm single row style2 pin1 right Through hole angled pin header THT 2x17 1.27mm double row Through hole angled pin header, 2x39, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 2x07, 2.00mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Surface mounted socket strip THT 1x16 2.00mm single row Through hole angled pin header, 1x03, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole IDC header, 2x12, 2.54mm pitch, double rows Surface.

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